As a global semiconductor leader in power systems and the Internet of Things, Infineon Technologies AG announced that it will supply silicon carbide (SiC) HybridPACK™ Drive G2 CoolSiC™ power modules and chip products for Xiaomi Motors’ latest SU7 smart electric car until 2027 Year. Infineon's CoolSiC™ power modules accommodate higher operating temperatures, enabling best-in-class performance, driving dynamics and longevity. For example, traction inverters based on this technology can further increase the range of electric vehicles. HybridPACK™ Drive is Infineon's market-leading electric vehicle power module series, with nearly 8.5 million units shipped since 2017.

Infineon supplies two 1200 V HybridPACK™ Drive G2 CoolSiC™ modules for the Xiaomi SU7 Max version. In addition, it supplies Xiaomi Auto with a wide range of other products that meet different needs, such as EiceDRIVER™ gate drivers and more than 10 microcontrollers in different applications. The two companies also agreed to further cooperate in SiC automotive applications to fully leverage the advantages of Infineon's silicon carbide product portfolio.